During the Si growth process in the zone melting directional solidification experiment, the wettability behavior of Si source/solvent metal and solvent metal/seed substrate is an important issue for Si purification and growth. In this work, the wettability behavior of Si/C and Si-90 wt% Sn alloy/C system was studied by using the sessile drop method. The results show that Si and Si–Sn alloy wet C substrate, and the wettability gradually improves with the holding time due to the generation of a SiC layer in the metal/C interface and the infiltration Si or Si–Sn alloy into C substrate. Moreover, the addition of Sn into Si melt is beneficial for Si to wet C substrate, because Sn hinders the generation of SiC and Si promotes Sn wetting C substrate.
CITATION STYLE
Li, Y., & Zhang, L. (2019). Wettability Behavior of Si/C and Si–Sn Alloy/C System. In Minerals, Metals and Materials Series (pp. 223–229). Springer International Publishing. https://doi.org/10.1007/978-3-030-06209-5_23
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