Performance of Printed Composite Polymer Materials using Unified Deposition Modeling: A Brief Review

Abstract

The addition of filler content into polymer composite can improve electrical and thermal conductivity, while the resulting high tensile strength and modulus values have expanded its application in the electronic device industry. However, the addition of a filler less than 20 wt.% resulted in imperfections in the dispersion and agglomeration of filler within the composite. The aim of this study was to identify the influence of the addition of filler content into composite polymer conductive materials using 3D printing to determine the electrical, thermal, and mechanical properties. The scope of this study covers the use of composite polymer materials using Fused Deposition Modeling (FDM) method in 3D printing. The layer-by-layer element of the 3D printing process produces complex object structures and its rapid manufacturing processes contributes significantly to the production of conductive polymer composite. The study found that electrical conductivity can be improved with the addition of filler content. In addition, the addition of filler content offers a more effective surface between the filler surface and the matrix increased the crystallisation temperature (Tc) and crystallisation peak temperature (Tp) in terms of the thermal properties, as well as the tensile strength and modulus values in terms of the mechanical properties. The approach provided in this review study was that the addition of filler content of up to 50 wt.% in polymer composite can improve the suitability of the material to be used in electronic devices.