Wiring the Tin–Silver–Copper alloy by fused deposition modeling

Abstract

This paper aims at investigating the feasibility of extrusion and molding a low-melting point metal, Sn–Ag–Cu alloy, on a substrate by fused deposition modeling (FDM). Two Sn–Ag–Cu alloys, one is eutectic Sn–3.0Ag–0.5Cu (SAC305) and another non-eutectic Sn–0.3Ag–0.7Cu (SAC307), are studied for their molding resolutions, material compositions, tensile strength, tear strength, and sheet resistivities after FDM process. The FDM system is assembled by the authors. The molding resolutions are measured by caliper and micrometer. The material compositions are analyzed by energy dispersive spectrometer (EDS). The tensile strengths and tear strengths are measured by Lloyd-LS1 tensile tester. The sheet resistivities are measured by four-point probe station. Some conclusions are drawn according to the experiments. For better resolution, the extrusion temperature is a little higher than the melting point of the material. The FDM process significantly reduces the tensile strength of the materials. For the tear strength, SAC305 is better than SAC0307. The higher the extrusion temperature is, the higher the sheet resistivity is.