Future Trend of Conductive Adhesive Technology

  • Li Y
  • Lu D
  • Wong C
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Abstract

As can be seen from previous chapters, tremendous progress has been made to improve the conductive adhesive technology for ICAs, ACA, and NCA.

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Li, Y., Lu, D., & Wong, C. P. (2010). Future Trend of Conductive Adhesive Technology. In Electrical Conductive Adhesives with Nanotechnologies (pp. 425–432). Springer US. https://doi.org/10.1007/978-0-387-88783-8_9

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