Temperature changes in composite materials during photopolymerization

8Citations
Citations of this article
9Readers
Mendeley users who have this article in their library.

Abstract

During polymerization, composite materials cause a temperature rise which may lead to irreversible changes in the dental pulp. The mechanical properties of composite materials depend on a number of factors, such as the composition of the material, the type of polymerization unit, the polymerization mode, and the duration of polymerization. The objective of this study was to assess the temperature rise values and flexural strength of composite materials, as obtained using different modes and times of polymerization. A total of six composite materials were used in the study. Samples of each of the materials were cured using seven polymerization protocols. A CMP-401 digital meter (Sonel, Świdnica, Poland), complete with a type K thermocouple (NiCr-Ni), was used to record the temperature increases during the light curing of the resin composites. Temperature rises were recorded beneath the composite disc in an acrylic matrix. The specimens were tested for flexural strength using a Cometech QC-508M2 testing machine. The lowest results for the increased mean temperature were obtained for Fast-Cure 3 s (39.0◦C), while the highest results were obtained for Fast-Cure 20 s (45.8◦C). The highest average temperature values for all tested protocols were recorded for the Z550 Filtek material. Mean flexural strengths as measured in each test group were higher than the minimum value for composite materials as per the ISO:4049 standard. In the case of deep caries with a thin layer of dentin separating the filling from pulp, a base layer or a short polymerization duration mode is recommended to protect pulp from thermal injury.

Cite

CITATION STYLE

APA

Szalewski, L., Szalewska, M., Jarosz, P., Woś, M., & Szymańska, J. (2021). Temperature changes in composite materials during photopolymerization. Applied Sciences (Switzerland), 11(2), 1–11. https://doi.org/10.3390/app11020474

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free