Application of maximum tangential stress criterion in determination of fracture initiation angles of silicon/ glass anodic bonds

Abstract

Silicon/glass bi-materials are used in micro-assembly and packaging of microelectromechanical systems (MEMS) and micro-electronics devices. In this paper, maximum tangential stress (MTS) concept is used for determination of the fracture initiation angles of silicon/ glass bi-material notches. First, the MTS criterion is analytically formulated for a bimaterial notch problem. Then, the criterion used for prediction of fracture initiation angles of some experimental data given in literature for silicon/ glass bi-material notches. In addition, the modified MTS (MMTS) criterion, which considers the effect of I-stress, was compared with the MTS criterion and the experimental data. It was shown that MMTS criterion provides more accurate results than the MTS criterion for estimation of the fracture initiation angle.