Convective Heat Transfer on the Optimum Spacing of High Heat Dissipating Heat Sources—A Numerical Approach

Abstract

The paper emphasizes the numerical investigation to analyse the three modes of conjugate convective heat transfer characteristics from seven non-identical heat sources (Aluminium) mounted on a substrate board (Bakelite). The objective is to determine the best mode of heat transfer which suits for cooling of ICs (heat sources), also temperature is non-dimensionalized as (θ), and it is predicted by applying fuzzy logic control. To accomplish this, numerical simulations are carried out using ANSYS Icepak to estimate the temperature distribution of the IC chips. Results suggest that the mixed convection is the better mode of heat transfer and the temperature of heat sources is reduced. Temperature of the heat sources is a strong function of their size and position on the substrate board. There is a strong agreement between the numerical values of ANSYS Icepak and predicted values obtained from fuzzy logic.