Abstract
Low temperature co-fired ceramic (LTCC) is a very promising and continually evolving substrate technology, which has been widely used in wireless communications, automotive, military and space, medical and several other industries. Especially, it enables manufacturing components and modules with high performance up to millimeter-wave region. In our chapter, we will review LTCC fabrication processes, characteristics all of main commercially available LTCC material systems and LTCC current status and trend. © 2010 Springer-Verlag US.
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CITATION STYLE
Yang, J., & Wang, Z. (2010). LTCC substrates for RF/MW application. In RF and Microwave Microelectronics Packaging (pp. 189–206). Springer US. https://doi.org/10.1007/978-1-4419-0984-8_9
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