Multilevel memory and synaptic characteristics of a-IGZO thin-film transistor with atomic layer-deposited Al2O3/ZnO/Al2O3 stack layers

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Abstract

A multilevel nonvolatile memory based on an amorphous indium-gallium-zinc oxide thin-film transistor is successfully demonstrated by using an atomic layer-deposited ZnO film as a charge trapping layer. The memory device shows a much higher erasing efficiency at a negative bias, i.e., after erasing at -13 V for 1 μs, the threshold voltage shift is as large as -7.4 V. In the case of 13 V/1 μs programming (P) and -12 V/1 μs erasing (E), the device demonstrates an ON/OFF readout drain current (IDS) ratio of 103 after 105 s, and a large and stable ON/OFF IDS ratio of 106 till 104 of P/E cycles. Furthermore, multilevel memory characteristics are also demonstrated on the device, showing an IDS ratio of >102 for 4 different states. Additionally, the device also successfully demonstrates typical synaptic behaviors, such as excitatory and inhibitory postsynaptic current with different memory times at different memory states.

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Liu, D. D., Pei, J., Li, L., Huo, J., Wu, X., Liu, W. J., & Ding, S. J. (2020, April 14). Multilevel memory and synaptic characteristics of a-IGZO thin-film transistor with atomic layer-deposited Al2O3/ZnO/Al2O3 stack layers. Journal of Materials Research. Cambridge University Press. https://doi.org/10.1557/jmr.2019.355

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