Adsorption Behavior of Polyoxyethyleneglycole on the Copper Surface in an Acid Copper Sulfate Bath

Abstract

The o鉦ect of polyoxyethyleneglycole（PEG）on the copper deposition and dissolution were stud－ ied in an acid coPPer sulfate bath as a function of electrode potential， polymerization degree of PEG and Cl一concentrations． In the presence of Cl一，PEG adsorbed on the copper surface to give an adhesive五lm causing remarkable suppression of the reaction current in the wide potential range of copper deposition and dissolution．While，in the Cl－free solution，PEG suppressed the reaction current in the potential range less negative than－150mVτ5． Cu2＋／Cu。Qnly the PEG which has the polymerization degree of more than7to10suppressed the reaction current The adsorption behavior of PEG was explained五n related 亡o亡he copper deposit三〇n．mechanism by the assump亡ion that the Cu＋ions are grasped in PEG molecules、