Effect of sintering temperature on microstructure and properties of nano-WC particle reinforced copper matrix composites prepared by hot-pressing sintering

Abstract

A novel nano-WC/Cu-based composite with nanometer WC dispersed in the copper matrix was successfully prepared by vacuum hot-pressing sintering. The effects of different hot-pressing sintering temperatures on the microstructure, conductivity, strength, and hardness of the composite were investigated. As a result, with the increase of temperature, the distribution of nano-WC particles in the matrix is more even, and the relative density can reach about 100% when sintering temperature increase to 1075 °C. The electrical conductivity of the composites sharply increases from 62.5 to 90% IACS when sintering temperature increase from 950 °C to 1100 °C. Furthermore, as the sintering temperature rises from 950 °C to 1100 °C, the ultimate tensile strength gradually increases from 123 to 425 Mpa, and the hardness increases from 127.5 to 150 HV. In addition, the composite also displayed excellent resistance to high temperature softening at 800 °C.