From 'scratch'

Abstract

The design of a high-density, multilayer, plated through-hole, large area (14.5 × 22 inches) PCB called the C3+ is reported. The prototype was expected to achieve the performance criteria necessary to satisfy a military contract which was available for tender. However, extensive testing revealed that the design would not operate at the required 50 MHz. The failure was attributed to parastic losses in the interconnects. Accordingly, SMT was proposed as the solution. An extensive design review dictated a single multilayer, ultra-high-density, double-sided, SMT assembly with over 1000 devices.