Local Rate of Electroless Copper Deposition By Scanning Tunneling Microscopy

Weber, C. J., Pickering, H. W., & Weil, K. G. (2005). Local Rate of Electroless Copper Deposition By Scanning Tunneling Microscopy. In Atomic Force Microscopy/Scanning Tunneling Microscopy 3 (pp. 121–123). Kluwer Academic Publishers. https://doi.org/10.1007/0-306-47095-0_11