Fast temperature calculation for transient electrothermal simulation by mixed frequency/time domain thermal model reduction

Abstract

In full-chip electrothermal analysis, the substrate is usually discretized into a lumped 3-D network to simulate the heat flow, which is computationally inefficient due to the numerous internal nodes representing the substrate interior. Yet traditional interconnect model reduction techniques are not very effective at handling complex multi-port networks with large port counts. In this work we overcome this limitation by applying time-domain approximation techniques such as ARWE and Prony's method to further simplify the reduced substrate thermal network. Experiments show that our method provides highly accurate simulation results with performance improvement in the range of 2× to 5×.