CITATION STYLE
Munding, A., Hübner, H., Kaiser, A., Penka, S., Benkart, P., & Kohn, E. (2008). Cu/Sn Solid–Liquid Interdiffusion Bonding (pp. 1–39). https://doi.org/10.1007/978-0-387-76534-1_7
Mendeley helps you to discover research relevant for your work.