Thermal Characterization

Abstract

The Cu nanoparticles capped by fatty acids and amines were synthesized. The thermal resistances of the Cu nanoparticle joints between Al2O 3 heater chips and Cu-65Mo baseplates were measured. The thermal conductivities of the Cu nanoparticle joints were estimated from the thermal resistances using finite element method. The Cu nanoparticle joint exhibited the much higher thermal conductivity (>125 W/m K) than ordinary solders. The thermal resistance of the Cu nanoparticle joint was almost constant after the power cycling for 3000 cycles up to 200 C even though that of the solder joint was rapidly increased. © 2013 Elsevier Ltd. All rights reserved.