Measurement of properties of copper telluride thin films using holography

Abstract

Holography is a technique employed to make three dimensional images using electromagnetic waves. Holographic interferometry is one of the most important applications of holography. It is concerned with the formation and interpretation of fringe patterns, which appears when a wave generated at some earlier time and stored in a hologram is later reconstructed by interfering with comparison wave. We report a technique, which uses double exposure holographic interferometry together with simple mathematical interpretation, which allows immediate finding of stress, mass, fringe width and thickness of thin film. We tested different normalities of solutions. It is observed that increase in deposition time increases thickness and mass of thin film but decreases stress to substrate. The thin films are prepared using electrodeposition technique. The structural, optical and surface wettability properties of the deposited films have been studied using X-ray diffraction (XRD), optical absorption and contact angle measurement, respectively.