Modelling of electrowetting‐induced droplet detachment and jumping over topographically micro‐structured surfaces

Abstract

Detachment and jumping of liquid droplets over solid surfaces under electrowetting actuation are of fundamental interest in many microfluidic and heat transfer applications. In this study we demonstrate the potential capabilities of our continuum‐level, sharp‐interface modelling approach, which overcomes some important limitations of convectional hydrodynamic models, when simulating droplet detachment and jumping dynamics over flat and micro‐structured surfaces. Preliminary calculations reveal a considerable connection between substrate microtopography and energy efficiency of the process. The latter results could be extended to the optimal design of micro‐structured solid surfaces for electrowetting‐induced droplet removal in ambient conditions.