The selection of strategic alliance in ic packaging and testing industry with dea resampling comparative evaluation

Abstract

Merger and acquisition (M&A) cases and the speed of horizontal integration have increased rapidly in the integrated circuit (IC) packaging and testing industry. Therefore, cooperation with suitable strategic alliance partner is a vital success factor for enterprises. This study proposes a “comparative evaluation” model that searches out appropriate strategic alliances on the basis of the resampling model acquired via data envelopment analysis (DEA). The realistic public data of 20 companies was collected from 2015 to 2019 in the IC packaging and testing industry. The super slacks-based measure model was used to evaluate the performance before alliance in the period from 2015 to 2019. The resampling past–present–future model was used to forecast the performance in 2020–2024. Afterward, a future strategic alliance for comparative evaluation of efficiency was established. The results of the alliance were divided into the groups “ineffective” and “effective”. The results show that 11 companies in the “effective” group achieved both improvements and 8 companies in the “ineffective” group achieved only unilateral improvements. The comparison model describes the efficiency of both sides simultaneously, not only from the perspective of the target but also from the perspective of the partner company. The evaluation model proposed in the study enables enterprises to find suitable alliance partners.