Microstructure Evolution and Chemical Composition in Continuous Directional Solidification Cu–P–Sn Alloy

Abstract

Ternary Cu–P–Sn alloy was prepared by continuous directional solidification (CDS) technique. The microstructure of CDS Cu–P–Sn alloy was analyzed by optical microscopy and field emission scanning electron microscopy. The chemical composition was analyzed by energy dispersive spectrometry. The results show that the CDS Cu–P–Sn alloy has many linear structures. The linear structures are vertically arranged along the solidification direction in the longitudinal section and arranged with a disorderly manner in the transverse section. The number of linear structures also is larger in transverse section than in longitudinal section. CDS Cu–P–Sn alloy has an exudation layer with a lamellar structure, which has high solute contents of P and Sn.