Development of an easy-debonding orthodontic adhesive using thermal heating

Abstract

We produced experimentally a new bonding material that consisted of a mixture of a base resin (4-META/MMA-TBB resin adhesive) and thermoexpandable microcapsules for safe, easy debonding. Microcapsules in the base resin would start expansion at 80°C, leading to a remarkable decrease in bond strength. Stainless steel brackets were bonded to bovine permanent mandibular incisors using bonding materials containing the microcapsules at different contents. After thermal cycling or heating, the shear bond strength of the brackets was measured. Shear bond strength of the bonding materials containing 30-40 wt% microcapsules decreased to about one-third or one-fifth that of the base resin on heating. Heating the brackets for eight seconds increased the temperature in the pulp chamber by 2°C, which should not induce pulp damage. Results obtained suggested that the new bonding material should prove useful for removing brackets easily at the time of bracket debonding without any pain or enamel cracks, while maintaining the bonding strength during active orthodontic treatment.