Modeling of metal-ferroelectric-insulator-semiconductor structures based on Langmuir-Blodgett copolymer films

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Abstract

Among the ferroelectric thin films used in field-effect transistor devices; the ferroelectric copolymer of polyvinylidene fluoride (PVDF) (-CH 2-CF2-), with trifluoroethylene (TrFE) (-CHF-CF 2-), has distinct advantages, including low dielectric constant, low processing temperature, low cost, and compatibility with organic semiconductors. The operation of a metal-ferroelectric-insulator-semiconductor structure with P(VDF-TrFE) as the ferroelectric layer was analyzed and optimized by numerical solution of the Miller and McWhorter model. A model device consisting of 20 nm PVDF/TrFE on a 10-nm-thick high- k dielectric buffer exhibits a memory window of 5 V with an operating voltage of ±15 V. The operating voltage can be reduced to ±12 V by reducing the ferroelectric and dielectric thicknesses to 10 and 5 nm, respectively. © 2009 American Institute of Physics.

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Reece, T. J., & Ducharme, S. (2009). Modeling of metal-ferroelectric-insulator-semiconductor structures based on Langmuir-Blodgett copolymer films. Journal of Applied Physics, 106(12). https://doi.org/10.1063/1.3271581

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