Grinding Wheel

Abstract

PROBLEM TO BE SOLVED: To improve chip discharging ability while attaining high accuracy machining by reducing machining load. ;SOLUTION: In this grinding wheel 50 with abrasive grains 53 fixed to the circumferential surface of a cylindrical base metal 51, the abrasive grains 53 are spirally arranged on the abrasive grain fixing surface of the base metal 51 to reduce the number of abrasive grains, and the abrasive grains 53 are exposed to laser beams to uniformize the height of the abrasive grains 53. Truing is applied by the irradiation of laser beams to uniformize the height of the abrasive grains, and a groove is formed on the abrasive grain fixing surface by laser irradiation. ;COPYRIGHT: (C)2004,JPO