Silver-Nanowire-Based Elastic Conductors: Preparation Processes and Substrate Adhesion

Abstract

The production of flexible electronic systems includes stretchable electrical interconnections and flexible electronic components, promoting the research and development of flexible conductors and stretchable conductive materials with large bending deformation or torsion resistance. Silver nanowires have the advantages of high conductivity, good transparency and flexibility in the development of flexible electronic products. In order to further prepare system-level flexible systems (such as autonomous full-software robots, etc.), it is necessary to focus on the conductivity of the system’s composite conductor and the robustness of the system at the physical level. In terms of conductor preparation processes and substrate adhesion strategies, the more commonly used solutions are selected. Four kinds of elastic preparation processes (pretensioned/geometrically topological matrix, conductive fiber, aerogel composite, mixed percolation dopant) and five kinds of processes (coating, embedding, changing surface energy, chemical bond and force, adjusting tension and diffusion) to enhance the adhesion of composite conductors using silver nanowires as current-carrying channel substrates were reviewed. It is recommended to use the preparation process of mixed percolation doping and the adhesion mode of embedding/chemical bonding under non-special conditions. Developments in 3D printing and soft robots are also discussed.