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Thermal Conductance Measurements of Pressed OFHC Copper Contacts at Liquid Helium Temperatures

  • Salerno L
  • Kittel P
  • Spivak A
Springer US, (1985), 187-195
DOI: 10.1007/978-1-4684-4916-7_21
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Abstract

The thermal conductance of pairs of oxygen-free high conductivity (OFHC) copper specimens with surface finishes ranging from 0.1 to 1.6-~m rms roughness has been investigated over the range of 1.6 to 6.0-K under applied contact forces up to 670 N. The thermal conductance increases with increasing contact force; however, no correlation can be drawn with respect to surface finish.

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APA

Salerno, L. J., Kittel, P., & Spivak, A. L. (1985). Thermal Conductance Measurements of Pressed OFHC Copper Contacts at Liquid Helium Temperatures. In Thermal Conductivity 18 (pp. 187–195). Springer US. https://doi.org/10.1007/978-1-4684-4916-7_21

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