Inkjet printing of copper wire on PET substrate

Abstract

A new process to fabricate copper pattern on PET substrate is developed in the experiment. Functional ink with ion-adsorption nanoparticles was printed on PET substrate to form the pattern adsorption film. Catalytic ion was adsorbed by amino groups in the adsorption film to catalyze the electroless plating process of copper. The mercapto groups were introduced to the film to enhance the reliability of patterns. In addition, the specific solvent was used in the ink to increase the surface roughness of adsorption film which leads to a better adhesion of the patterns. The conductivity of prepared copper patterns is the same as bulk copper and the patterns show good adhesion on PET substrate.