Realisation of fail-safe, cost competitive sensor systems with advanced 3D-MEMS elements

Abstract

Developing MEMS structures is a first milestone for creating a successful final product. The industrialization reveals whether the concept is ready for mass production with an acceptable yield to meet commercial aspects as well as the requirements for reliability and performance over lifetime. By taking the robust bulk-micromachining technology from today's high volume series production and combining it with modern DRIE technology towards 3D-MEMS technology VTI has developed its own concept to condense the high performance to smaller dimensions. The next generation of low-g sensors will utilize this platform for single as well as multiple axes sensor systems. A new accelerometer family is created within one housing so that suiting to all measurement requirements it is just necessary to install the appropriate sensor component on the same PCB position. Main target is to meet fail-safe requirements, bring system costs down, reduce size and enable new functionality applications in the automotive environment. This article shows how to close the link between excellent sensor element development and the integration into application where sensor components need to fulfil advanced and enhancing criteria for modern sensor systems.