3D integration has become one of the most promising techniques for the integration future multi-core processors, since it improves performance and reduces power consumption by decreasing global wire length. However, 3D integration causes serious thermal problems since the closer proximity of heat generating dies makes existing thermal hotspots more severe. Thermal-aware floorplanners can play an important role to improve the thermal profile, but they have failed in considering the dynamic power profiles of the applications. This paper proposes a novel thermal-aware floorplanner guided by the power profiling of a set of benchmarks that are representative of the application scope. The results show how our approach outperforms the thermal metrics as compared with the worst-case scenario usually considered in " traditional" thermal-aware floorplanners. © 2011 Springer-Verlag.
CITATION STYLE
Arnaldo, I., Risco-Martín, J. L., Ayala, J. L., & Hidalgo, J. I. (2011). Power profiling-guided floorplanner for thermal optimization in 3D multiprocessor architectures. In Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics) (Vol. 6951 LNCS, pp. 11–21). https://doi.org/10.1007/978-3-642-24154-3_2
Mendeley helps you to discover research relevant for your work.