An Inverse Kinematic Analysis Modeling on a 6-PSS Compliant Parallel Platform for Optoelectronic Packaging

Abstract

Multiple degree of freedom motion platform is always one of the important components in optoelectronic packaging systems, its characteristics have a vital impact on the performances of optoelectronic packaging. This paper presents a 6-Prismatic-Spherical-Spherical compliant parallel platform for optoelectronic packaging. This platform is a kind of parallel layout structure, which uses the piezoelectric motors as active joints and the large-stroke flexure hinges are employed as passive joints. An inverse kinematic modeling based on elastokinematic analysis is analyzed and deduced. The elastokinematic analysis considers the elastic deformation of the large-stroke flexure hinges in movement process, and improves the positioning accuracy of the compliant parallel platform in applications. The finite element analysis model and the prototype of the compliant parallel platform are developed, and the validity of the proposed method is finally verified. This paper provides a theoretical reference and experimental data for the inverse kinematic analysis of six degrees of freedom motion compliant parallel platforms with large-stroke flexure hinges.