Laser cladding technology enables the regeneration or manufacturing of machine parts with the improved surface layer properties. The materials applied during the laser cladding processes very often contain hard and wear-resistant tungsten carbide (WC) particles. However, the parts obtained after the laser cladding have usually unsatisfactory surface quality and thus require post-process finishing. In addition, the content of WC particles causes that clad layers are difficult to cut. Therefore, in order to improve their machinability, the laser-assisted machining (LAM) technology can be applied. Nevertheless, the material removal mechanisms during LAM of WC/NiCr clad layers are not recognized. Thus, this study is focused on the estimation of minimum uncut chip thickness and analysis of cutting forces which are important factors describing the chip decohesion process. The proposed method is based on the novel approach dedicated directly to the oblique cutting, considering the zeroth tangential force increment located onto rounded cutting edge. The experimental procedure involves cutting force component (Fc, Ff, Fp) measurements in the range of variable cutting conditions, as well as the cutting tool’s micro-geometry inspection. On the basis of the measurements carried out, the force regression equations are formulated and subsequently applied to the determination of tangential force expression. Subsequently, the minimum uncut chip thickness is calculated on the basis of the equation derived from the zero tangential force increment condition and presented in function of cutting speed. The obtained results enable the effective selection of the cutting parameters during LAM of WC/NiCr clad layers.
CITATION STYLE
Przestacki, D., Chwalczuk, T., & Wojciechowski, S. (2017). The study on minimum uncut chip thickness and cutting forces during laser-assisted turning of WC/NiCr clad layers. International Journal of Advanced Manufacturing Technology, 91(9–12), 3887–3898. https://doi.org/10.1007/s00170-017-0035-5
Mendeley helps you to discover research relevant for your work.