LED and optical device packaging and materials

Abstract

As for integrated circuit (IC) device packaging, the packaging materials are critical to the LED packaging because the device packaging and assembly yield, and the device reliability and lifetime are determined by the quality of packaging and assembly materials as well as their processing. This presents serious challenges to the development of LED packaging materials, which is exactly the objective of this chapter to review those challenges and to point out the direction of further development. It is proper to point out here that although this chapter will focus on the packaging materials for LEDs, the information provided by this chapter is equally applicable to the packaging of other optical devices including laser diodes, optical sensors, fiber optic devices, optical detectors, optical couplers, etc. The first section will review materials challenges and some solutions for the packaging of high power LEDs, followed by functions of packaging and materials for advanced optoelectronic device packaging/manufacturing. The advanced encapsulation, lens, chip bonding and PCB materials for high power LED packaging will be presented in these sections. As a conclusion, we will point out the directions of materials for advanced high-power LED and optoelectronic device packaging as well as the requirements and approaches to determine LED performance and reliability. © 2009 Springer-Verlag US.