Microstructure and tensile strength of Cu with nano-scale twins

Abstract

Tensile test was performed on an electrodeposited pure Cu sample with high density growth-in twins confined in the submicro-sized grains. It is found that the Cu sample has an ultra-high tensile strength (∼1.0 GPa) and a good ductility (∼13.5%). Microstructure observations indicated that twin boundary provides a strong barrier for the motion of dislocations during plastic deformation. © 2007 Springer.