Thermal properties and corrosion resistance of organoclay/epoxy resin film

Abstract

Hybrid materials organoclay/epoxy resin films were prepared by varying organoclay content in epoxy resin as a matrix. The film were investigated by thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), Fourier transform infrared spectroscopy (FT-IR), scanning electron microscopy (SEM), and thermal conductivity. TGA and FT-IR results confirmed that the melting temperature shifted to a lower point. The thermal conductivity and corrosion resistant generally increase with increasing organoclay content. The changes on these properties may due to cross link between organoclay and epoxy.