A deep micro-trench on silica glass fabricated by laserinduced backside wet etching (LIBWE)

Abstract

By using laser-induced backside wet etching (LIBWE), we have fabricated very deep micro-trenches in silica glass of 9-μm width and 300-μm depth (aspect ratio 33). In this paper, we present the details of fabricating the micro-trenches, and discuss why such a deep micro-trench is available by the LIBWE method. © 2007 IOP Publishing Ltd.