Abstract
More and more, the ultimate reliability of a printed circuit board is considered to depend on its cleanliness level. The three main reasons for this are the increased use of faster soldering speeds which demand fluxes with higher activity levels, developments in PCB technology which permit higher density conductor lines and spacings needed for higher frequencies and opeating levels, and the assembly of surface-mounted components, introducing extra problems with regard to flux entrapment between the board surface and components.
Cite
CITATION STYLE
Westerlaken, E. (1985). Rosin Solder Flux Residues. In The Electronics Assembly Handbook (pp. 309–317). Springer Berlin Heidelberg. https://doi.org/10.1007/978-3-662-13161-9_52
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