Interconnect power analysis for a coarse-grained reconfigurable array processor

Abstract

Coarse-grained reconfigurable array processors (CGRAs) offer a promising path to high performance and power efficient processing. Increasing power dissipation at interconnect wires that comes with advanced process technologies may become a major problem for heavily interconnected CGRA processors. In our study we show that for a typical 90 nm process technology power in wire interconnects is still a fractional part of total power. © 2009 Springer Berlin Heidelberg.