The Simulation and Research of Etching Function Based on Scanning Electrochemical Microscopy

Abstract

Scanning electrochemical microscopy (SECM) has already been employed as a micromachining method for a long time. However, coupling effects of some factors, including the voltage of the tool electrode, the distance between the tool electrode and substrates, tip current, and machining time on the machining process, have not been clearly stated. In this study, based on simulation and experimental results, an etching function between the etching depth and the above influencing factors in the machining process with SECM is proposed. First, the influence of the tool electrode, the distance between the tool electrode and substrates, tip current, and machining time on the etching depth was analyzed by a two-dimensional (2D) axisymmetric finite element model. Second, the etching function between these factors and the etching depth was established. Finally, this relationship was then simplified and verified by etching experiments. In summary, the etching function can be used to guide the etching process to machine 2D and 3D microstructures with SECM.