Device design and scalability of an impact ionization MOS transistor with an elevated impact ionization region

Abstract

This paper reports a novel L-shaped Impact-ionization MOS (LI-MOS) transistor structure that achieves a subthreshold swing of well below 60 mV/decade at room temperature and operates at a low supply voltage. The device features an L-shaped or elevated Impact-ionization region (1-region) which displaces the hot carrier activity away from the gate dielectric region to improve hot carrier reliability and VT stability problems. Device physics and design principles for the LI-MOS transistor are detailed through extensive two-dimensional device simulations. The LI-MOS transistor exhibits excellent scalability, making it suitable for augmenting the performance of standard CMOS transistors in future technology generations.