Significance of Knowledge Reuse in the Three Dimensional Academic Environments

  • Khan* M
  • et al.
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In the present research an effort is being made to understand the significance of knowledge reuse in an academic environment. For this we will require appreciating the role of knowledge reuse, sharing and its management. Quality of reusable tacit and explicit knowledge has also been discussed. Various issues of knowledge quality and reusability in contemporary age have been analyzed. For comprehend the above undertakings in greater details we apply the three dimensional model of knowledge reuse and management by Harsh based on Nonaka and Takeuchi model and present the discussion on the various issues of knowledge reusability and its applications in an academic environment. Suggestions to improve the reusable tacit and explicit knowledge for a country like India are being also detailed. In the present investigation the importance of reusable tacit and explicit knowledge in diverse learning situation which is extensively valuable for the country like India is being explored. In academic environment it is very much essential to analyze the flow of the knowledge. Reusability concept not only providing a way to achieve the desired objective but also encapsulating the tacit as well as explicit knowledge. Combination of the knowledge is quite interesting field in academic environment. This study helps in optimization of educational resources by simple a technique of reuse. Present discussion also point out the enhancement of quality of tacit and explicit reusable knowledge as a result of its refinement in a three dimensional knowledge environment. Application of Information and communication technology can further exploit not only the effortless confined reusable knowledge while it also opens the enormous opportunity for trouble-free applications of reusable knowledge.




Khan*, M. S., & Harsh, O. K. (2020). Significance of Knowledge Reuse in the Three Dimensional Academic Environments. International Journal of Innovative Technology and Exploring Engineering, 4(9), 2745–2751.

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