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Thermal Desorption Spectrometry as a Method of Analysis for Advanced Interconnect Materials

  • Carbonell L
  • Hoyas A
  • Whelan C
  • et al.
Springer-Verlag, (2006), 475-483
DOI: 10.1007/1-84628-235-7_38
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Carbonell, L., Hoyas, A. M., Whelan, C. M., & Vereecke, G. (2006). Thermal Desorption Spectrometry as a Method of Analysis for Advanced Interconnect Materials. In Materials for Information Technology (pp. 475–483). Springer-Verlag. https://doi.org/10.1007/1-84628-235-7_38

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