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Book Chapter

Demand and Challenges for Wafer-Level Chip-Scale Analog and Power Packaging

  • Qu S
  • Liu Y
Springer New York, (2015), 1-14
DOI: 10.1007/978-1-4939-1556-9_1
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Qu, S., & Liu, Y. (2015). Demand and Challenges for Wafer-Level Chip-Scale Analog and Power Packaging. In Wafer-Level Chip-Scale Packaging (pp. 1–14). Springer New York. https://doi.org/10.1007/978-1-4939-1556-9_1

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