CITATION STYLE
Chang-Chien, P. P. L., & Wise, K. D. (2001). Wafer-Level Packaging Using Localized Mass Deposition. In Transducers ’01 Eurosensors XV (pp. 182–185). Springer Berlin Heidelberg. https://doi.org/10.1007/978-3-642-59497-7_42
Mendeley helps you to discover research relevant for your work.