Skip to main content
Book Chapter

Copper Wire Bonding

  • Chauhan P
  • Choubey A
  • Zhong Z
  • et al.
Springer New York, (2014), 1-9
DOI: 10.1007/978-1-4614-5761-9_1
N/ACitations
Citations of this article
12Readers
Mendeley users who have this article in their library.
Get full text

Abstract

Chapter 1 gives an introduction to Cu wire bonding technology. The advantages of Cu over Au, such as lower cost, higher mechanical strength, and higher electrical and thermal conductivity, are discussed. The chapter describes the adoption of Cu wire bonding in the...

Cite

CITATION STYLE

APA

Chauhan, P. S., Choubey, A., Zhong, Z., & Pecht, M. G. (2014). Copper Wire Bonding. In Copper Wire Bonding (pp. 1–9). Springer New York. https://doi.org/10.1007/978-1-4614-5761-9_1

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free