Calculation of failure rate of semiconductor devices based on mechanism consistency

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Abstract

Failure rate data of components is widely used in reliability design and analysis, such as reliability apportionment, reliability prediction, FMECA and so on. Currently, there are two major ways to evaluate failure rate: using prediction handbooks and accelerated life test. Updates to data in handbooks always are delayed, while accelerated life test costs lots of time and money, especially large scale integrated circuits are expensive. In view of the defect, using corresponding test data provided by manufacturer’s website to calculate failure rate is proposed based on failure mechanism consistency. Test data is analyzed and calculated to get failure rate of Semiconductor devices with each influencing mechanism, and values of failure rate under each mechanism are added together to get total failure rate based on the assumption of competition between mechanism.

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Ye, C., Chen, Y., & Kang, R. (2015). Calculation of failure rate of semiconductor devices based on mechanism consistency. Lecture Notes in Mechanical Engineering, 19, 1789–1796. https://doi.org/10.1007/978-3-319-09507-3_153

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