The fundamentals of chemical vapour deposition

Abstract

Fundamentals of the chemical vapour deposition process are described and examples given of its application. The most important aspects of the process are reviewed; these include deposit structure (with its relation to process parameters), process control through application of the principles of thermodynamics and reaction kinetics (with emphasis on deposit thickness uniformity, deposit composition control and deposit-substrate adherence) and basic design features of the equipment used. © 1977 Chapman and Hall Ltd.