The effect of substrate dissolution in brazing CP-Ti and Ti-15-3 using clad Ti-15Cu-15Ni filler

Abstract

The effect of substrate dissolution in brazing CP-Ti and Ti-15-3 using Ti-15Cu-15Ni filler metal has been performed in the experiment. Microstructures of infrared brazed joints are strongly related to dissolution of substrate during brazing. For the 1 800 s brazed CP-Ti specimen, the depletion of Cu and Ni from the braze alloy into substrate cause eutectoid transformation of β-Ti into lamellar Ti2Cu and α-Ti. In contrast, dissolution of Ti-15-3 substrate into the molten braze during infrared brazing results in the 1 800 s brazed zone alloyed with V, stabilizing the β-Ti to room temperature. © 2010 ISIJ.