Design of single pin shorted three-dielectric-layered substrates rectangular patch microstrip antenna for communication systems

Abstract

In this paper, we have simulated a single-pin-shorted microstrip line fed three-dielectric-layer (with different permittivity and thickness) rectangular patch microstrip antenna for all those communication systems whose limited antenna size is premium. Low permittivity hard foam has been used as one substrate to achieve wide bandwidth. The simulation of this proposed antenna has been performed by using CST Microwave Studio, which is a commercially available electromagnetic simulator based on the finite difference time domain technique.