Comparative Study of Rectangular, Trapezoidal and Parabolic Shaped Finned Heat sink

Abstract

This paper deals with the comparative study of heat sink having fins of various profiles namely Rectangular, Trapezoidal and Parabolic as heat sinks are the commonly used devices for enhancing heat transfer in electronic components. For the purpose of study heat sink is modeled by using the optimal geometric parameter such as fin height, fin thickness, base height, fin pitch as 48 mm, 1.6 mm, 8mm, 2mm and after that simulation is done at different heat load of 50W, 75W, 100W and with a air flow at 15CFM and air inlet temperature is taken as 295 K. The simulation is carried out with a commercial package provided by fluent incorporation. The result obtained taking into consideration only the thermal performance. As per the current era of the technological development everything is needed to be compact; whether it is a normal computer or laptop or the rack server we need everything that can be placed in a small space, so here the space constraint plays an major role as you cannot install a large heat sink for your device as it increases the size and the cost. So in this paper the pitch of fin is kept 2mm.