This chapter provides a brief overview on nanomaterials and nanopackaging, and then a review on recent advances on nanoparticles and their applications, lead-free nanosolder, carbon nanotubes (CNT) and their applications for interconnect, thermal management, and integration into microsystems. Also, operation principle, fabrication techniques, and packaging of piezoelectric nanogenerators based on vertically aligned Zinc oxide (ZnO) nanowires (NWs) are reviewed in great details and possible solutions for improving the nanogenerator's performance by improving the packaging technique are discussed. © 2009 Springer-Verlag US.
CITATION STYLE
Wang, X. D., Wang, Z. L., Jiang, H. J., Zhu, L., Wong, C. P., & Morris, J. E. (2009). Nanomaterials and nanopackaging. In Materials for Advanced Packaging (pp. 503–545). Springer US. https://doi.org/10.1007/978-0-387-78219-5_15
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