Properties of high-density fiberboard bonded with urea–formaldehyde resin and ammonium lignosulfonate as a bio-based additive

Abstract

The potential of ammonium lignosulfonate (ALS) as an eco-friendly additive to urea– formaldehyde (UF) resin for manufacturing high-density fiberboard (HDF) panels with acceptable properties and low free formaldehyde emission was investigated in this work. The HDF panels were manufactured in the laboratory with very low UF resin content (4%) and ALS addition levels varying from 4% to 8% based on the mass of the dry wood fibers. The press factor applied was 15 s·mm−1 . The physical properties (water absorption and thickness swelling), mechanical properties (bending strength, modulus of elasticity, and internal bond strength), and free formaldehyde emission were evaluated in accordance with the European standards. In general, the developed HDF panels exhibited acceptable physical and mechanical properties, fulfilling the standard requirements for HDF panels for use in load-bearing applications. Markedly, the laboratory-produced panels had low free formaldehyde emission ranging from 2.0 to 1.4 mg/100 g, thus fulfilling the requirements of the E0 and super E0 emission grades and confirming the positive effect of ALS as a formaldehyde scavenger. The thermal analyses performed, i.e., differential scanning calorimetry (DSC), thermal gravimetric analysis (TGA), and derivative thermogravimetry (DTG), also confirmed the main findings of the research. It was concluded that ALS as a bio-based, formaldehyde-free adhesive can be efficiently utilized as an eco-friendly additive to UF adhesive formulations for manufacturing wood-based panels under industrial conditions.